GALLUNOPTIMAL Solder Tin ISO Core Soldering Wire Clear Sn100Ni+ Sn99.3CuNiGe 1 mm on 100 g Spool Made by Felder GmbH in Germany
GALLUNOPTIMAL Solder Tin ISO Core Soldering Wire Clear Sn100Ni+ Sn99.3CuNiGe 1 mm on 100 g Spool Made by Felder GmbH in Germany
GALLUNOPTIMAL Solder Tin ISO Core Soldering Wire Clear Sn100Ni+ Sn99.3CuNiGe 1 mm on 100 g Spool Made by Felder GmbH in Germany
ISO-Core Soldering Wire Sn100Ni+, Sn99.3CuNiGe, according to Fuji-Pat.-No DE19816671C2, melting point 227°C, with 2.2% flux content clear according to DIN EN 29454/1.1.3.B REL1 (F-SW32) 1.0 mm to 100 g. SpSp
Product Features
- This lead-free solder is ideal for electronics, whether for THD or SMD components.
- Its eutectic melting range is 227C, which ensures a low working temperature and reduces the thermal load on the components.
- This is a clear wire, which means cleaning the solder joints is not necessary, the flux residues are crystal clear
- The flux content is 2.2% REL1 (free from rosin / with halogen) which allows optimal wetting of the solder joint
- Alloy: Sn 99, 3CuNiGe/Box contents: 100 g spool with a wire diameter of 1 mm - produced for Gallunoptimal by Felder GmbH in Germany
Original: $101.41
-65%$101.41
$35.49More Images
GALLUNOPTIMAL Solder Tin ISO Core Soldering Wire Clear Sn100Ni+ Sn99.3CuNiGe 1 mm on 100 g Spool Made by Felder GmbH in Germany
GALLUNOPTIMAL Solder Tin ISO Core Soldering Wire Clear Sn100Ni+ Sn99.3CuNiGe 1 mm on 100 g Spool Made by Felder GmbH in Germany
ISO-Core Soldering Wire Sn100Ni+, Sn99.3CuNiGe, according to Fuji-Pat.-No DE19816671C2, melting point 227°C, with 2.2% flux content clear according to DIN EN 29454/1.1.3.B REL1 (F-SW32) 1.0 mm to 100 g. SpSp
Product Features
- This lead-free solder is ideal for electronics, whether for THD or SMD components.
- Its eutectic melting range is 227C, which ensures a low working temperature and reduces the thermal load on the components.
- This is a clear wire, which means cleaning the solder joints is not necessary, the flux residues are crystal clear
- The flux content is 2.2% REL1 (free from rosin / with halogen) which allows optimal wetting of the solder joint
- Alloy: Sn 99, 3CuNiGe/Box contents: 100 g spool with a wire diameter of 1 mm - produced for Gallunoptimal by Felder GmbH in Germany
Product Information
Product Information
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Description
GALLUNOPTIMAL Solder Tin ISO Core Soldering Wire Clear Sn100Ni+ Sn99.3CuNiGe 1 mm on 100 g Spool Made by Felder GmbH in Germany
ISO-Core Soldering Wire Sn100Ni+, Sn99.3CuNiGe, according to Fuji-Pat.-No DE19816671C2, melting point 227°C, with 2.2% flux content clear according to DIN EN 29454/1.1.3.B REL1 (F-SW32) 1.0 mm to 100 g. SpSp
Product Features
- This lead-free solder is ideal for electronics, whether for THD or SMD components.
- Its eutectic melting range is 227C, which ensures a low working temperature and reduces the thermal load on the components.
- This is a clear wire, which means cleaning the solder joints is not necessary, the flux residues are crystal clear
- The flux content is 2.2% REL1 (free from rosin / with halogen) which allows optimal wetting of the solder joint
- Alloy: Sn 99, 3CuNiGe/Box contents: 100 g spool with a wire diameter of 1 mm - produced for Gallunoptimal by Felder GmbH in Germany
